DISCO is a leading solution provider for advanced Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies. We develop and manufacture precision dicing, grinding and polishing machines as well as dicing blades and grinding/polishing wheels. Ablation laser and stealth laser dicing saws, plasma processing and tape mounting equipment are also available from us. Our unique advantage is that we can provide you with not only machines and consumables, but also the total process solutions based on our wide range of application experiences.

Especially for laser solutions:
- Ablation laser for full cut and grooving
- Stealth laser dicing
- KABRA (New SiC ingot slicing method)
- Laser Lift-Off (LLO)
- Via hole laser
- Other unique laser processing