Our technology and products are rooted in a decade of industry near research and development in integrated photonics at Karlsruhe Institute of Technology (KIT), and 20 years of experience in building high-precision assembly machinery for photonic packaging.

Headquartered in Karlsruhe, Germany, we develop technology and products including machines, software, materials and processes for creating low-loss photonic interconnects between passive and active optical components.

These photonics interconnects are fabricated leveraging our unique and growing IP portfolio for Photonic Wire Bonding (PWB) and Facet-Attached Micro-Lenses (FAML).

Building on nano-print technology, our solutions enable high packaging density, increased design flexibility and fabrication throughput.