High-accuracy die bonder systems for R&D, prototyping and production.

Finetech is a leading provider of manual and automatic die bonders for high-precision micro-assembly and advanced die-attach applications. With our machines, we help customers turn their visions into reality—across industries as diverse as aerospace, medical and biotechnology, consumer electronics, the semiconductor industry, as well as universities and research institutions worldwide. Our modularly expandable hardware and software enable application-specific machine configurations. Thanks to our "Prototype-to-Production" approach, all assembly processes can be seamlessly transferred from the R&D phase to automated manufacturing, enabling integrated, flexible, and cost-efficient product development.