Upon customer request, LASER COMPONENTS can coat substrates with diameters of up to 390 mm, including, for example, wafers that are required in microchip manufacturing and other industries. The blanks may consist of silicon, fused silica, N-BK7, or other glasses. In addition to standard coatings, it is also possible to achieve application-specific coatings, such as AR coatings and all mirror types.
In many cases, chip wafers and similar components must also be equipped with dielectric layers. However, this is usually not part of the manufacturer’s core business. As a result, many companies do not have the necessary equipment or know-how to apply reliable coatings. LASER COMPONENTS is a partner with decades of experience in the application of thin films. The manufacturer delivers the cleaned wafers, indicates the desired specifications, and receives the finished coated parts back after a few weeks.