EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
EVG’s products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications.
With application labs and cleanrooms Europe, North America and Asia, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base.
Founded in 1980, the company is headquartered in Austria, with fully-owned subsidiaries in the U.S., Japan, South Korea, China and Taiwan. The company employs more than 1400 people worldwide.