27th World's Leading Trade Fair with Congress for
Photonics Components, Systems and Applications
June 24–27, 2025 | Messe München
Photonics Components, Systems and Applications
June 24–27, 2025 | Messe München
Exhibitor portal
Bay Photonics Ltd
Bay Photonics design and package photonic devices at our ISO9001 UK facility.
Company profile
Bay Photonics delivers design services and packaging services for photonic devices, PICs.
The packaging capabilities include manual and automated processes for die bonding, vacuum reflow soldering, wire bonding, fiber alignment, free space optical assembly and hermetic sealing.
Testing includes die shear, bond pull, fine and gross leak, vision, SEM and x-ray.
The work is carried out by our experienced team in our UKAS accredited ISO9001 certified operation in the United Kingdom.
The packaging capabilities include manual and automated processes for die bonding, vacuum reflow soldering, wire bonding, fiber alignment, free space optical assembly and hermetic sealing.
Testing includes die shear, bond pull, fine and gross leak, vision, SEM and x-ray.
The work is carried out by our experienced team in our UKAS accredited ISO9001 certified operation in the United Kingdom.
Contact
Bay Photonics Ltd
EPIC Waddeton Close, Paignton TQ4 7RZ, Great Britain
Contact request