Miniature components for mounting/interconnect of semiconductor devices

LEW Techniques provides bespoke, precision submounts/carriers for laser diodes, bars, stacks and photodiodes inc: super-sharp edge tungsten/copper submounts (<5µm radius) for right-at-the-edge diode mounting; WCu inserts brazed to Cu bodies for maximum heat-sinking and minimum carrier-die expansion mismatch; aluminium nitride (AlN) submounts with photo-patterned metallised high-precision circuits; tailored metal structures for soldering, wirebonding, electrical and thermal performance; thin-layer AuSn selective solder coating (typ. 3-5µm) for accurate, consistent mounting of die; metal coatings and solder alloy consistency for best reflow results; photodiode mounts with wrapover conductors and circuits on multiple faces for interconnect flexibility and precision ceramic for functionality.