Bay Photonics design and package photonic devices at our ISO9001 UK facility.

Bay Photonics delivers design services and packaging services for photonic devices, PICs.
The packaging capabilities include manual and automated processes for die bonding, vacuum reflow soldering, wire bonding, fiber alignment, free space optical assembly and hermetic sealing.
Testing includes die shear, bond pull, fine and gross leak, vision, SEM and x-ray.
The work is carried out by our experienced team in our UKAS accredited ISO9001 certified operation in the United Kingdom.