26. Weltleitmesse und Kongress für Komponenten,
Systeme und Anwendungen der Photonik
27.–30. Juni 2023 | Messe München
Ausstellerportal
Mobile Navigation
 
Substrates, wafers manufacturer, CNC machining, lapping, polishing, dicing

Unternehmensprofil

ISO 9001:2015 manufacturer of substrates, wafers, windows, discs, precison shims and spacers and other flat optical and electro optical components.

Provider of 4/5 Axis CNC machining services, precision lapping, polishing, grinding, dicing services.

Special capabilities: Ultra-thin (10um), ultra-flat (1/4 wave), superpolishing (<5A), tight tolerances +/- 1um).

Materials processed: Glass, Fused Silica, Quartz, Ceramics, Aluminum Nitride, Alumina, Sapphire, Silicon, Macor, Ferrites, PEEK, Ultem, Color Filter Glass, Molybdenum, Metals, Stainless Steel, Aluminum and others.
Many materials in stock, 1000's of finished wafers and substrates available from inventory. 

Industries: Semiconductor, Telecommunications, Medical, Research and Development, AS9100 Aerospace certification pending.

Hauptaussteller

Kontaktdaten