TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" technology which crosses five leading-edge technologies such as Cutting, Grinding, Polishing, Metalizing, and Bonding.
In particular, our processing (technology) are using at the following fields.
- Customized heatsinks for Laser Diode and LED
- Structured glass wafers for MEMS packaging
- Glass micro fluidic for Drug discovery and Chemical reaction
We support your design and manufacturing with our Cross-edge technologies.