25. Weltleitmesse für Komponenten, Systeme und Anwendungen der Photonik
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Tecnisco Ltd.

Tecnisco Ltd.
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Heatsink experts with T1K -Silver Diamond 1000W/mk class thermal conductivity

Unternehmensprofil

TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" technology which crosses five leading-edge technologies such as Cutting, Grinding, Polishing, Metalizing, and Bonding.

In particular, our processing (technology) are using at the following fields.
- Customized heatsinks for Laser Diode and LED
- Structured glass wafers for MEMS packaging
- Glass micro fluidic for Drug discovery and Chemical reaction

We support your design and manufacturing with our Cross-edge technologies.

Kontaktdaten

Tecnisco Ltd.
2-2-15 Minami-Shinagawa, Shinagawa-ku, Tokyo 1400004, Japan
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